Structural design points in arrayed micro thermal sensors (III) ~ Polymer-based approach ~
Maret 2017
Hirofumi Miki, Shigeki Tsuchitani

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In our prior work of silicon-based approach, it was understood that over 80 % of the input power that applied to the sensor was consumed at the substrate which results in the performance decrement of the sensor. To get the improved results, it is important to decrease the thermal capacity of the sensing elements and the substrate, and at the same time to improve the thermal isolation between the sensing elements and the surrounding parts (mainly the substrate and wiring) to the utmost limit. The most sensitive parameter will be the material property such as thermal conductivity. In this paper, we report the experimentally demonstrated results on the structural design points applying the fabricated prototype that based on polymer approach.

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  • Eye Icon 47 kali dilihat
  • Download Icon 14 downloads
Metrics Icon 47 kali dilihat  //  14 downloads